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in TechdayRapidus and Cadence Partner on Agentic AI for Advanced SoC Design
Rapidus Corporation and Cadence (Nasdaq: CDNS) today announced a collaboration to advance agentic AI for advanced-node system-on-chip (SoC) design by integrating the Cadence® InnoStack™ AI Super Agent into the Rapidus AI-Agentic Design Solution (Raads). The joint effort combines Rapidus’ AI-native design and manufacturing ecosystem for advanced-node semiconductors with Cadence’s agentic AI design orchestration technology to […] More
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in Sundae Scoop, TechdayCadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs
Cadence (Nasdaq: CDNS) today announced an expanded collaboration with Intel Foundry to advance Design Technology Co-Optimization (DTCO) targeting Intel’s next-generation process technologies, beginning with Intel 14A. The new multi-year agreement combines Cadence’s agentic AI-driven EDA and Design IP solutions with Intel’s process innovation and advanced design expertise. More
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in Sundae Scoop, TechdayCadence Unveils Industry’s First Fully Autonomous Virtual Engineer for Chip Design, powered by NVIDIA
At Computex 2026, Cadence (Nasdaq: CDNS) announced the industry’s first fully autonomous virtual agentic AI design engineer, extending the ChipStack™ AI Super Agent to Level-5 autonomy. Built on Cadence’s AI-driven electronic design automation (EDA) portfolio with NVIDIA Nemotron models, and secured by NVIDIA OpenShell runtime, the new agentic capabilities enable customers to run dynamic simulations […] More
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in Sundae Scoop, TechdayCadence and Samsung Foundry Deepen 2nm and 3D‑IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand
Cadence (Nasdaq: CDNS) and Samsung Foundry announced development of a full portfolio of Memory and Interface IP, and expanded certification of Cadence’s agentic AI digital, custom, 3D‑IC and system design and analysis (SDA) flows for Samsung Foundry’s second-generation 2nm process technology. This collaboration delivers a signoff‑ready platform for next‑generation AI infrastructure and physical AI designs […] More
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in TechdayAeva Adopts Cadence Tensilica Vision DSP to Advance Lidar Performance and Efficiency
Cadence (Nasdaq: CDNS) today announced that Aeva, a leader in next-generation sensing and perception systems, has licensed Cadence® Tensilica® Vision DSP IP to accelerate signal processing in its 4D LiDAR systems—enabling flexible and scalable solutions for industrial robotics and automotive applications. This design win marks a significant step in delivering high-performance, low-power lidar systems optimized […] More
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in Sundae Scoop, TechdayCadence and NVIDIA Expand Partnership to Reinvent Engineering for the Age of AI and Accelerated Computing
At CadenceLIVE Silicon Valley 2026, Cadence (Nasdaq: CDNS) announced an expanded partnership with NVIDIA to deliver accelerated solutions across agentic AI, physics-based simulation and digital twins to unlock new levels of productivity and accelerate next‑generation engineering design flows across semiconductor design, physical AI systems and hyperscale AI factories. More
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in Sundae Scoop, TechdayCadence and Google Collaborate to Scale AI-Driven Chip Design with ChipStack AI Super Agent on Google Cloud
Cadence, an industry leader in AI-driven computational software for semiconductor and system design, today announced a strategic collaboration with Google to optimize the Cadence® ChipStack™ AI Super Agent with Gemini on Google Cloud. This collaboration positions Cadence at the forefront of the shift toward agentic design automation, creating an agent-driven, scalable, cloud-native platform for next-generation […] More